description: the central semiconductor 3smc5.0ca series types are surface mount bi-directional glass passivated junction transient voltage suppressors designed to protect voltage sensitive components from high voltage transients. this device is manufactured with a glass passivated chip for optimum reli- ability. note: for uni-directional devices, please refer to the 3smc5.0a series data sheet. marking code: see marking code on electrical characteristic table 3smc5.0ca thru 3smc170ca surface mount bi-directional glass passivated junction silicon transient voltage suppressor 3000 watts, 5.0 thru 170 volts smc case central semiconductor corp. tm r4 (3-march 2008) stand-off voltage specified by ? this series is ul listed, ul file number e130224 notes: (1) non-repetitive 10x1,000s pulse type reverse stand-off voltage breakdown voltage (v br @ i t ) test current maximum reverse leakage maximum clamping voltage peak pulse current (note 1) marking code v rwm min max i t i r @ v rwm v c @ i pp i pp v v v ma a v a 3smc5.0ca 5.0 6.40 7.25 10 2000 9.2 326.0 cide 3smc6.0ca 6.0 6.67 7.67 10 2000 10.3 291.3 cidg 3smc6.5ca 6.5 7.22 8.30 10 1000 11.2 267.9 cidk 3smc7.0ca 7.0 7.78 8.95 10 400 12.0 250.0 cidm 3smc7.5ca 7.5 8.33 9.58 1.0 200 12.9 232.6 cidp 3smc8.0ca 8.0 8.89 10.23 1.0 100 13.6 220.6 cidr 3smc8.5ca 8.5 9.44 10.82 1.0 50 14.4 208.4 cidt 3smc9.0ca 9.0 10.0 11.5 1.0 20 15.4 194.8 cidv 3smc10ca 10 11.1 12.8 1.0 5.0 17.0 176.4 cidx 3smc11ca 11 12.2 14.0 1.0 5.0 18.2 184.8 cidz 3smc12ca 12 13.3 15.3 1.0 5.0 19.9 150.6 ciee 3smc13ca 13 14.4 16.5 1.0 5.0 21.5 139.4 cieg 3smc14ca 14 15.6 17.9 1.0 5.0 23.2 129.4 ciek 3smc15ca 15 16.7 19.2 1.0 5.0 24.4 123.0 ciem 3smc16ca 16 17.8 20.5 1.0 5.0 26.0 115.4 ciep 3smc17ca 17 18.9 21.7 1.0 5.0 27.6 106.6 cier 3smc18ca 18 20.0 23.3 1.0 5.0 29.2 102.8 ciet 3smc20ca 20 22.2 25.5 1.0 5.0 32.4 92.6 ciev 3smc22ca 22 24.4 28.0 1.0 5.0 35.5 84.4 ciex 3smc24ca 24 26.7 30.7 1.0 5.0 38.9 77.2 ciez 3smc26ca 26 28.9 33.2 1.0 5.0 42.1 71.2 cife 3smc28ca 28 31.1 35.8 1.0 5.0 45.4 66.0 cifg 3smc30ca 30 33.3 38.3 1.0 5.0 48.4 62.0 cifk maximum ratings: (t a =25c unless otherwise noted) symbol units peak power dissipation (note 1) p dm 3000 w peak forward surge current (jedec method) i fsm 200 a operating and storage junction temperature t j , tstg -65 to +150 c electrical characteristics: (t a =25c unless otherwise noted)
central semiconductor corp. tm 3smc5.0ca thru 3smc170ca surface mount bi-directional glass passivated junction silicon transient voltage suppressor 3000 watts, 5.0 thru 170 volts electrical characteristics - continued: smc - case - mechanical outline r4 (3-march 2008) type reverse stand-off voltage breakdown voltage (v br @ i t ) test current maximum reverse leakage maximum clamping voltage peak pulse current (note 1) marking code v rwm min max i t i r @ v rwm v c @ i pp i pp v v v ma a v a 3smc33ca 33 36.7 42.2 1.0 5.0 53.3 56.2 cifm 3smc36ca 36 40.0 46.0 1.0 5.0 58.1 51.6 cifp 3smc40ca 40 44.4 51.1 1.0 5.0 64.5 46.4 cifr 3smc43ca 43 47.8 54.9 1.0 5.0 69.4 43.2 cift 3smc45ca 45 50.0 57.5 1.0 5.0 72.7 41.2 cifv 3smc48ca 48 53.3 61.3 1.0 5.0 77.4 38.8 cifx 3smc51ca 51 56.7 65.2 1.0 5.0 82.4 36.4 cifz 3smc54ca 54 60.0 69.0 1.0 5.0 87.1 34.4 cige 3smc58ca 58 64.4 74.1 1.0 5.0 93.6 32.0 cigg 3smc60ca 60 66.7 76.7 1.0 5.0 96.8 31.0 cigk 3smc64ca 64 71.1 81.8 1.0 5.0 103 29.2 cigm 3smc70ca 70 77.8 89.5 1.0 5.0 113 26.6 cigp 3smc75ca 75 83.3 95.8 1.0 5.0 121 24.8 cigr 3smc78ca 78 86.7 99.7 1.0 5.0 126 22.8 cigt 3smc85ca 85 94.4 108.2 1.0 5.0 137 20.8 cigv 3smc90ca 90 100.0 115.5 1.0 5.0 146 20.6 cigx 3smc100ca 100 111.0 128.0 1.0 5.0 162 18.6 cigz 3smc110ca 110 122.0 140.5 1.0 5.0 177 16.8 cihe 3smc120ca 120 133.0 153.0 1.0 5.0 193 15.6 cihg 3smc130ca 130 144.0 165.5 1.0 5.0 209 14.4 cihk 3smc150ca 150 167.0 192.5 1.0 5.0 243 12.4 cihm 3smc160ca 160 178.0 205.0 1.0 5.0 259 11.6 cihp 3smc170ca 170 189.0 217.5 1.0 5.0 275 11.0 cihr
package details - central semiconductor corp. www.centralsemi.com tm r1 (10-december 2002) mechanical drawing smc mounting pad geometry (dimensions in mm) part marking: 3-6 character alpha/numeric code lead code: reference individual device datasheet.
package details - central semiconductor corp. www.centralsemi.com tm r1 (10-december 2002) tape dimensions and orientation (dimensions in mm.) tape width: 16mm reel labeling information each reel is labeled with the following information: central part number, customer part number, purchase order number, quantity, lot number, date code, ship date and marking code. smc packaging base 13? reel = 3,000 pcs. (add tr13 suffix to part number) bulk = 100 pcs. (add bk suffix to part number) reel packing information ordering information ? for devices taped and reeled on 13? reels, add tr13 suffix to part number. ? for devices bulk packed, add bk suffix to part number. ? all smds are available bulk packed, for prototype and manual placement applications. direction of unreeling reel quantity number of box dimensions shipping weight size per box reels per box inch cm lb kg 13? 39,000 13 14x14x8 36x36x20 22 10 * devices are taped in accordance with electronic industries association standard eia-481-2-a
material composition specification smc case pb (lead)-free plating** component material material substance cas no. substance (%wt) (mg) (%wt) (mg) (ppm) active device doped si 1.63% 3.8 si 7440-21-3 1.6% 3.8 16,000 leadframe copper 39.107% 90.92 cu 7440-50-8 39.107% 90.92 391,070 die attach high temperature solder paste 1.875% 4.36 pb 7439-92-1 1.735% 4.033 17,350 sn 7440-31-5 0.094% 0.218 940 ag 7440-22-4 0.047% 0.109 470 encapsulation* emc 56.77% 132 silica 7631-86-9 38.606% 89.76 386,060 epoxy resin proprietary 17.032% 39.6 170,320 sb 2 o 3 1309-64-4 0.568% 1.32 5,680 tbba 79-94-7 0.568 % 1.32 5,680 emc green 56.77 % 132 silica 7631-86-9 39.39% 91.592 393,942 epoxy resin proprietary 17.38% 40.408 173,798 plating** tin lead process 0.661% 1.419 sn 7440-31-5 0.529% 1.135 5,290 pb 7439-92-1 0.132% 0.335 1,320 100% tin process 0.661% 1.419 sn 7440-31-5 0.77% 0.708 7,700 central tm semiconductor corp. www.centralsemi.com r2 (10-march 2008) device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232.5 mg fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% *emc green molding compound is halogen-free. **specify lead-free when ordering 100% tin (pb-free) plating. disclaimer the information provided in this material composition data sheet is, to our knowledge, correct. however, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
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